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During the chip manufacturing process, there are four major contamination issues that can occur on the chip surface: particles, organic residues, inorganic residues, and oxide layers that need to be removed. If the cleaning accuracy is not sufficient, the residual impurities can cause electrical failure in the chip. In chip production, 80% of electrical failures are caused by defects from contamination. Therefore, semiconductor cleaning processes are crucial for chip yield and the fundamental basis for cleaning equipment companies to establish their competitive advantage.

Due to the cleaning process, it is necessary not only to remove the photoresist on the wafer surface but also to eliminate complex etching residues, metal debris particles, and other contaminants. Therefore, there is a need for updated, more precise, and environmentally friendly cleaning methods.

DSJet utilizes dry ice particles to break down burrs, particulates, and other impurities on the surface of semiconductor chips, achieving a high level of cleanliness required for semiconductor surfaces. This solution addresses incomplete cleaning of particles and surface contaminants on power semiconductor chips, which can lead to voltage breakdown or tip discharge issues during high-pressure testing.